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Tungsten, molybdenum, tantalum,etc.

• Micro drilling
• Lathe machining
• Milling

• They perform fabrication for a wide range of sizes, from ⌀3 to 220 mm,and they can handle everything from prototype development to mass production fabrication for difficult-to-cut materials
• They can achieve a fabrication precision of ±3 μm even for tungsten,which is known for being difficult to cut.

Silicon, glass, quartz,etc.

• Dry etching
• Wet etching
• Photolithography
• Wafer testing

• Uses deep reactive ion etching (DRIE) technology to perform microfabrication, even for microcomponents.
• Specializes in technologies such as MEMS and photonics and provides mass production-oriented services.

Silicon, glass, copper,Etc.

• Photolithography
• Thin film deposition
• Sputtering

• A comprehensive MEMS foundry that provides integrated support for everything from photolithography to film deposition and sputtering.
• In addition to silicon, it can also work with glass, multi-layer film, and transparent wafers.